GEHAEUSE AUS KUNSTSTOFF ERFUELLEN INDUSTRIEANFORDERUNGEN. = LES BOITIERS DE PLASTIQUE SATISFONT AUX EXIGENCES INDUSTRIELLESFRANKOWSKI G.1978; ELEKTRONIK; DTSCH.; DA. 1978; VOL. 27; NO 4; PP. 112-114Article

PREMOLDED MICROCIRCUIT PACKAGES COME ON STRONG.SMITH PE.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 6; PP. 17-19Article

INVESTIGATION OF THE MOLECULAR PROCESSES CONTROLLING CORROSION FAILURE MECHANISMS IN PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICESLUM RM; FEINSTEIN LG.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 1; PP. 15-31; BIBL. 12 REF.Article

A CASE HISTORY: PROCUREMENT OF QUALITY PLASTIC ENCAPSULATED SEMICONDUCTORS.HAKIM EB.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 71-73Article

Composants semi-conducteurs à encapsulation plastique pour systèmes de télécommunicationsSTROEHLE, D.Revue des Télécommunications. 1982, Vol 57, Num 2, pp 152-156, issn 0373-8582Article

Cross-talk phenomena in a 1-3 connectivity piezoelectric compositeWILM, Mikaël; ARMATI, Raphaël; DANIAU, William et al.The Journal of the Acoustical Society of America. 2004, Vol 116, Num 5, pp 2948-2955, issn 0001-4966, 8 p.Article

DEVELOPMENTS LIKELY TO IMPROVE THE RELIABILITY OF PLASTIC ENCAPSULATED DEVICES.JONES RO.1978; MICROELECTRON. AND RELIABIL.; GBR; DA. 1978; VOL. 17; NO 2; PP. 273-278; BIBL. 2 REF.Article

PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICES. A BIBLIOGRAPHY.TAYLOR CH.1977; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1977; VOL. 16; NO 6; PP. 701-704Article

TRANSFER MOLDING METHODS EXPAND PACKAGING TECHNIQUES.KAKEI M; IKEDA Y.1977; J. ELECTRON. ENGNG; JAP.; DA. 1977; NO 126; PP. 59-62Article

THE USE OF RELIABLE PLASTIC SEMICONDUCTORS IN MILITARY EQUIPMENT.REICH B; HAKIM EB.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 1; PP. 29-33; BIBL. 6 REF.Article

ENCAPSULATION PLASTIQUE DES TRANSISTORSOLTEANU D; PAVELESCU I.1976; ELECTROTEH. ELECTRON. AUTOMAT., AUTOMAT. ELECTRON.; ROMAN.; DA. 1976; VOL. 20; NO 1; PP. 51-53Article

RELIABILITY OF PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITSREICH B.1978; SOLID STATE TECHNOL.; USA; DA. 1978; VOL. 21; NO 9; PP. 82-88; BIBL. 10 REF.Article

EPOXY MOLDING COMPOUNDS FOR SEMICONDUCTOR ENCAPSULATION.REINHART J.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 8; PP. 29-31Article

JUST HOW RELIABLE ARE PLASTIC ENCAPSULATED SEMICONDUCTORS FOR MILITARY APPLICATIONS AND HOW CAN THE MAXIMUM RELIABILITY BE OBTAINED.TAYLOR CH.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 2; PP. 131-134; BIBL. 12 REF.Article

RELIABILITY TO MOISTURE PROOF CHARACTERISTICS OF RESIN-COATED ELECTRONIC PARTS.KOSHIBA S; YAMASHITA S; KANOU K et al.1976; BULL. ELECTROTECH. LAB.; JAP.; DA. 1976; VOL. 40; NO 3; PP. 230-238; BIBL. 2 REF.Article

MONOLITHIC DUAL DARLINGTON IN PLASTIC.ROMANO A; STABELLINI F.1975; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1975; VOL. 14; NO 4; PP. 398Article

ENCAPSULATING SMALL, HEAT-SENSITIVE COMPONENTS WITH QUICKCURE EPOXY COATING POWDERS.BOLGER JC.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 10; PP. 39-42Article

HOW TO SELECT AND EVALUATE ADHESIVE AND PATTING COMPOUND DISPENSING EQUIPMENT.HALLWORTH AM.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 10; PP. 33-36Article

RESOLUTION OF THE GOLD WIRE GRAIN GROWTH FAILURE MECHANISM IN PLASTIC ENCAPSULATED MICROELECTRONIC DEVICESJAMES HK.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 370-374; BIBL. 6 REF.Article

TOUGHENING AGENTS IMPROVE EPOXY EUCAPSULANTS.ABSHIER CS; BERRY J; MAGET HJR et al.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 11; PP. 27-29; BIBL. 4 REF.Article

ACCELERATION FACTORS FOR PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICES AND THEIR RELATIONSHIP TO FIELD PERFORMANCE.REICH B.1975; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1975; VOL. 14; NO 1; PP. 63-66; BIBL. 13 REF.Article

METALLIZED HERMETIC PLASTIC PACKAGESMARTINO RR.1973; ELECTRON. COMPON.; G.B.; DA. 1973; VOL. 14; NO 11; PP. 516Serial Issue

RECIPROCATING SCREW ENCAPSULATION: THE NEW METHOD FOR PLASTIC ENCAPSULATIONFLEISCHMANN JJ.1973; INSULAT./CIRCUITS; U.S.A.; DA. 1973; VOL. 19; NO 3; PP. 35-38Serial Issue

BOITIERS CERAMIQUE OU PLASTIQUE: QUELLE EST LEUR FIABILITE.BICKLEY J.1981; ELECTRON. IND.; FRA; DA. 1981; NO 9; PP. 37-39Article

LOW AND MEDIUM STRENGTH PERMANENT MAGNETS BY COMPACTING OR INJECTION MOLDING PLASTIC-COATED BARIUM FERRITE.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 3; PP. 29-30Article